View CYIS1SM1000AA-HQC_2474631.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

star1000 1m pixel radiation hard cmos image senso r star1000 cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document number: 38-05714 rev. *b revised january 5, 2007 key features the star1000 sensor has the following characteristics: ? integrating 3-transistor active pixel sensor. ? 1024 by 1024 pixels on 15 m pitch. ? radiation tolerant design. ? on-chip double sampling circuit to cancel fixed pattern noise. ? electronic shutter. ? read out rate: up to 11 full frames per second. ? region of interest (roi) windowing. ? on-chip 10-bit adc. ? programmable gain amplifier. ? ceramic jlcc-84 package. ? available with bk7g18 glass and with n 2 filled cavity. sensor description the star1000 is a cmos image sensor with 1024 by 1024 pixels on a 15 mm pitch. it features on-chip fixed pattern noise (fpn) correction, a programmable gain amplifier, and a 10-bit analog-to-digital converter (adc). all circuits are designed using the radiation tolerant design rules for cmos image sensors, to allow a high tolerance against total dose effects. registers that are directly acce ssed by the external controller contain the x- and y- addresses of the pixels to be read. this architecture provides flexible operation and allows different operation modes such as (multiple) windowing, subsampling, etc. two versions od sensors are available: star1000 and star1000bk7. the star1000 has a quartz glass lid and the cavity between the die and the lid is filled with air. the star1000bk7 has a bk7g18 glass lid and the cavity is filled with n 2 which increases the temperature operating range. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 2 of 21 image sensor specifications general specifications electro-optical specifications table 1. general specification of the star1000 sensor parameter specification comment detector technology cmos active pixel sensor pixel structure 3-transistor active pixel radiation-tolerant pixel design. photodiode high fill factor photodiode using n-well technique. sensitive area format 1024 x 1024 pixels pixel size 15 x15 m 2 pixel output rate 12 mhz speed can be exchanged for power consumption. windowing x- and y- addressing random programmable electronic shutter electronic rolling shutter. range: 1:1024 integration time is variable in time steps equal to the row readout time. total dose radiation tolerance > 250 krad (si) pixel test struct ures with a similar design have shown total dose tolerance up to several mrad. note: dark current and dsnu are dependent of radiation dose. proton radiation tolerance 2,4.10 11 proton/cm 2 at 60 mev seu tolerance > 127,8 mev cm 3 mg -1 table 2. electro-optical specifications of the star1000 sensor parameter value comment typical value unit spectral range 400 - 1000 nm quantum efficiency x fill factor 20% average over the visual range. see spectral response curve. full well capacity 135.000 e- saturation capacity to meet non-linearity within + 5% 99.000 e- output signal swing 1.1 v conversion gain 11.4 v/e- ktc noise 47 e- dynamic range 69 db fixed pattern noise local: 1 < 0.30% global: 1 <0.56% of full well photo response non-uniformity at sat/2 (rms) local: 1 < 0.67% global: <3.93% of full well [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 3 of 21 average dark current at 293k 223 a/cm 2 dark current signal 3135 e-/s dark current rises 425 e-/s per krad. dsnu signal 1.055% of vsat dsnu rises 14 e-/s per krad. optical cross-talk at 600 nm vertical: 16% horizontal: 17.5% anti-blooming capacity x 1000 output amplifier gain x1, x2.47, x4 .59 and x8.64 controlled by 2 bits. analogue input bandwidth 9.5 mhz analogue input signal range 0.1 to 4.9 v analog-to-digital converter 10 bit radiation-tolerant version of the adc on ibis4 and other image sensors. adc differential non-linearity (dnl) <= 3.5 lsb adc integral non-linearity (inl) <= 5.8 lsb integral non-linearity of adc is better than linearity of image sensor. supply voltage 5 v digital input signals are 3.3v compatible. power dissipation < 350 < 100 mw with internal adc powered. without internal adc powered. both values measured at nominal speed (12 mhz). table 2. electro-optical specifications of the star1000 sensor (continued) parameter value comment typical value unit [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 4 of 21 spectral response figure 1. spectral response curve photo-voltaic response figure 2. photo voltaic response curve 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 400 500 600 700 800 900 1000 wavelenght [nm] spectral response [a/w] qe 0.01 qe 0.05 qe 0.1 qe 0.2 qe 0.3 0 0,2 0,4 0,6 0,8 1 1,2 0 20000 40000 60000 80000 100000 120000 140000 160000 180000 number of electrons voltage swing at output [v] [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 5 of 21 absolute maximum ratings table 3. absolute maximum ratings star1000 characteristics limits units remarks min max any supply voltage -0.5 +7 v r voltage on any input terminal -0.5 vdd + 0.5 v operating temperature 0 +60 c tem perature range confirmed by evaluation testing. storage temperature -10 +60 c not longer than 1 hour. temperature range confirmed by evaluation testing. sensor soldering temperature na 125 c hand soldering only. the sensor?s temper- ature may not rise above this limit. please read the soldering and handling section for more information. table 4. absolute maximum ratings star1000bk7 characteristics limits units remarks min max any supply voltage -0.5 +7 v voltage on any input terminal -0.5 vdd + 0.5 v operating temperature -40 +85 c temperature range confirmed by evaluation testing. storage temperature -40 +85 c temperature range confirmed by evaluation testing. -40 +120 maximum 1 hour. sensor soldering temper- ature na 125 c hand soldering only. the sensor?s temper- ature may not rise above this limit. please read the soldering and handling section for more information. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 6 of 21 dc operating conditions table 5. dc operating conditions symbol parameter limits units min typ max vdda analog supply of the image core. 5 v vddd digital supply of the image core. 5 v vdd_adc_ana analog supply of the adc circuitry. 5 v vdd_adc_dig digital supply of the adc circuitry. 5 v vdd_dig_out power supply of adc digital output stage. 5 v vres reset level fo r reset signal. 5 v vref reset level for reset_ds signal. 4 5 v gnda analog ground of the image core. 0 v gndd digital ground of the image core. 0 v gnd_adc_ana analog ground of the adc circuitry. 0 v gnd_adc_dig digital ground of the adc circuitry. 0 v v ih logical '1' input voltage. 1.8 vddd v v il logical '0' input voltage. 0 1 v v oh logical '1' output voltage. 4.25 vddd v v ol logical '0' output voltage. 1 v [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 7 of 21 architecture floor plan figure 3. star1000 floor plan the image sensor contains five sections: the pixel array, the x- and y- addressing logic, the column amplifiers, the output amplifier and the adc. figure 3. shows an outline diagram of the sensor, including an indication of the main control signals. the following paragraphs explain in more detail the function and operation of the different imager parts. pixel array the pixel array contains 1024 by 1024 active pixels at 15 m pitch. each pixel contains one photo diode and three transistors (figure 4.). the photo diode is always in reverse bias. at the beginning of the integration cycle, a pulse is applied to the reset line (gate of t1) bringing the cathode of d1 to the reset voltage level. during the integration period, photon-generated electrons accumulate on the diode capacitance reducing the voltage on the gate of t2. the real illumination dependent signal is the difference between the reset level and the output level after integration. this difference is created in the column amplifiers. t2 acts as a source follower and t3 allows connection of the pixel signal (reset level and output level) to the vertical output bus. the reset lines and the read lines of the pixels in a row are connected together to the y- dec oder logic; the outputs of the pixels in a column are connected together to a column amplifier. figure 4. architecture of the 3t pixel reset reset_ds vref ld_y a0....a9 latch y address decoder and logic pixel array 1024 x 1024 pixels 1024 rst 1024 rd 10 rst rd col 10-bit adc 10 d0...d9 clk_adc ain s r column amplifiers 1024 1024 1024 10 10 1024 1024 clk_x latch ld_x x register x address decoder rst sig progr. gain amplifier multiplexer buffer aout blackref cal g0f g1 ain1 ain2 ain3 sel0 sel1 t1 t2 t3 read column bus reset [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 8 of 21 addressing logic the addressing logic allows direct addressing of rows and columns. instead of the one-hot shift registers that are often used, address decoders are implemented. one can select a line by presenting the required address to the address input of the device and latching it to the y- decoder logic. presenting the x- address to the device address input and latching it to the x- address decoder can select a column. a typical line read out sequence will first select a line by applying the y-address to the y-decoder. activation of the ld_y input on the y-logic connects the pixel outputs of the selected line to the column amplifiers. the individual column amplifier outputs are connect ed to the output amplifier by applying the respective x- addresses to the x- address decoder. applying the appropriate y- address to the y- decoder and activating the ?reset? input reset a line. the integration time of a row is t he time between the last reset of this row and the time when it is selected for read out. the y- decoder logic has two different reset inputs: reset and reset_ds. activation of r eset resets the pixel to the vdd level; activation of reset _ds resets the pixel to the voltage level on the vref input. this feature allows the appli- cation of the so called dual slope integration. if dual slope integration is not needed, vref is tied to vdd and reset_ds must never be activated. column amplifiers all outputs from the pixels in a column are connected in parallel to a column amplifier. this amplifier samples the output voltage and the reset level of the pixel whose row is selected at that moment and presents these voltage levels to the output amplifier. as a result, the pixels are always reset immediately after read out as part of the sample procedure. note that the maximum integration time of a pixel is the time between two read cycles. output amplifier and analog multiplexer the output amplifier combines s ubtraction of pixel signal level from reset level with a programmable gain amplifier. since the amplifier is ac coupled, it also contains a provision to maintain and restore the proper dc level. an analog signal multiplexing feeds the pixel signal to the final unity gain buffer, providing the required drive capability. apart from the pixel signal, three other external analog signals can be fed to the output buffer. all these signals can be digitalised by the on-chip adc if the output of this buffer is externally connected to the input of the adc. the purpose of the additional analog inputs (a_in1, a_in2, and a_in3) is to allow the possibility of processing other analog signals through the image sensors signal path. these signals can then be converted by the adc and processed by the image controller fpga. the additional analog inputs are intended for low frequency or dc signals and have a reduced bandwidth compared with the image signal path. adc the image sensor has a 10-bi t adc that is electrically separated from the rest of the image sensor circuits and can be powered down if an external adc is used. the conversion takes place at the falling edge of the clock and the output pins can be disabled to allow operation of the device in a bus structure. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 9 of 21 timing and control signals the pixels addressing is done by direct addressing of rows and columns. this approach has the advantage of full flexibility when accessing the pixel array: multiple windowing and subsampled read out are possible by proper programming. the following paragraphs clarify the timing for row and column readout. row selection and reset timing figure 5. shows the timing of the line sequence control signals. the timing constraints are presented in table 6. the address, presented at the address io pins (a0?a9) is latched in with the ld-y pulse (active low). after latching; the external controller already produces a new address. figure 5. line selection and reset sequence latching in a y- address selects the addressed row and connects the pixel outputs of that row to the column amplifiers. through the sequence of the s and r pulse and the reset pulse in between the pixel output signal and reset level are sampled and produced at the output of the column amplifier (to do the fpn double sampling correction). at this time horizontal read out of the selected row is started and another row is reset to effectuate reduced integration time (electronic rolling shutter). a0......a9 ld_y internal s reset r cal (once each frame) row readout read address reset address k l m k l m row selected for readout row selected for reset a b c d e b hi f d g time available for readout of row y-1 idle time available for x-readout of row y [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 10 of 21 pixel read out timing figure 6. shows the timing of the pixel readout sequence. the external digital controller presents a column address that is latched by the rising edge of the ld_x pulse. after decoding the x- address the column se lection is clocked in the x- register by clk-x. the output amplifier uses the same pulse to subtract the pixel output le vel from the pixel reset level and the signal level. this causes a pipeline effect such that the analog output of the first pixel is effectively present at the device output terminal at the third rising edge of the x-clk signal. the adc conversion starts at the falling edge of the clk-adc signal and produces a valid digital output 20 ns after this edge. the timing constraints are given in table 7. important note: the values of the x shift-register tend to leak away after a while. therefore it is very important to keep the clk_x signal asserted for as long as the sensor is powered up. if the sensor sits idle and clk_x is not asserted, the leakage of the x shift-register will cause multiple columns to be selected at once. this forces high current through the sensor and may cause damage. table 6. timing constraints of line sequence symbol min typ description a3.6 s delay between selection of a new row and falling edge on s. minimal value: for maximum, speed a new row can already be selected during x- read out of the previous row. b0.4 s duration of s and r pulse. c 0 100 ns delay between falling edge of s and rising edge of reset. d 200 ns minimum duration of reset pulse. e1.6 s delay between falling edge of reset and falling edge of r. f 0 100 ns minimum delay between falling edge on ld_y and rising edge of reset. g g minimum required extension of y- address after falling edge of reset pulse. h 100 ns 200 ns position of cal pulse after rising edge of s. the cal pulse must only be given once per frame. i 100 ns 1 s duration of cal pulse. k 10 ns address set up time. l 20 ns load register value. m 10 ns address stable after load. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 11 of 21 figure 6. column selection and read out sequence x1 x6 x5 x7 x8 x4 x3 x2 b a c x4 x3 x2 x1 x1 x2 x3 x4 x5 x6 a0......a9 ld_x clk_x analog output clk_adc d9......d0 undefined output level row idle time table 7. timing constraints of column read out symbol min typ description a 20 ns address setup time. b 40 ns address valid time. c 0 20 ns adc output valid after falling edge of clk_adc. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 12 of 21 pin list figure 7. displays the pin connections of the star1000. the tables that follow group the connections by their functionality. figure 7. star1000 pin connections table 8. pin list of the star1000 sensor pin pin name pin type pin description 1 a3 input digital input.address inputs for row and column addressing. a9=lsb, a0=msb. 2 a4 input 3 a5 input 4 a6 input 5 a7 input 6 a8 input 7 a9 input 8 ld_y input digital input. latch address (a0?a9) to y-register (0 = track, 1 = hold). [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 13 of 21 9 ld_x input digital input. latch address (a0?a9) to x-register (0 = track, 1 = hold). 10 vdda supply analog power supply of the imager (typical 5v). 11 gndd ground digital ground of the imager. 12 gnda ground analog ground of the imager. 13 clk_x input digital input. clock x-register (output valid & stable when clk_x is high). 14 reset_ds input digital input (high active). re sets row indicated by y-address (see sensor timing diagram). reset_ds is used for dual-sl ope integration (see faq). gnd is used for normal operation. 15 vddd supply digital supply of the image sensor. 16 reset input digital input (hi gh active). resets row indica ted by y-address (see sensor timing diagram). 17 s input digital input (high active). control signal for column amplifier (see sensor timing diagram). 18 r input digital input (high active). control signal for column amplifier (see sensor timing diagram). 19 nbias_dec input analog input. biasing of address decoder. connect with 100 k ? to vdda and decouple with 100 to gnd. 20 a_in2 input additional analog inputs. for proper conversion with on-chip adc, the input signal must lie within the output signal range of the image sensor (approximately +2v to +4v). 21 a_in3 input 22 a_in1 input 23 a_sel1 input selection of analog channel: '00' selects image sensor ('01' selects a_in1, '10' a_in2, and '11' a_in3). 24 a_sel0 input 25 nbias_oamp input analog input. bias of output amplifier (speed/power control). connect with 100 k ? to vdda and decouple with 100 nf to gnd for 12.5 mhz output rate (lower resistor values yield higher maximal pixel rates at the cost of extra power dissipation). 26 pbias input analog input. biasing of the multiplexer circuitry. connect with 20 k to gnd and decouple with 100 nf to vdd. 27 g1 input digital input. select output amplifier gain value: g0 = lsb, g1 = msb ('00' = unity gain, '01' = x2, '10'= x4, '11'=x8). 28 g0 input 29 cal input digital input (active high). initiali zation of output amplif ier. output amplifier outputs blackref in unity gain mode when cal is high (1). apply pulse pattern (see sensor timing diagram). 30 out output analog output video signal. connected to the analog input of the internal (pin 52) 10-bit adc or an external adc. 31 blackref input analog input. control voltage for output signal offset level. buffered on-chip, the reference level can be generated by a 100 k resistive divider. connect to 2v dc for use with on-chip adc. 32 vdda supply analog power supply of image core (typical 5v). 33 vddd supply digital power supply of image core (typical 5v). table 8. pin list of the star1000 sensor (continued) pin pin name pin type pin description [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 14 of 21 34 gnda ground analog ground of image core. 35 gndd ground digital ground of image core. 36 nbias_array input analog input. biasing of the pixel array. connect with 1m ? to vdda and decouple with 100 nf capacitor to gnd. 37 testpix_out output output of single test pixe l. is used for electro-optical evaluation. 38 testpix_reset input digital input (active high). re set signal of single test pixel. used to reset the single test pixel during electro-optical evaluation. 39 n.c. 40 n.c. 41 n.c. 42 n.c. 43 n.c. 44 n.c. 45 n.c. 46 n.c. 47 n.c. 48 testpixarray output analog output of an array of 20 x 35 test pixels where all photodiodes are connected in parallel. is used for electro-optical evaluation. 49 photodiode output plain photo diode (without ci rcuitry). area of the photodiode = 20 x 35 pixels. is used for electro-optical evaluation. 50 nbias_ana input analog input. analog biasing of the adc circuitry. connect with 100 k ? to vdda and decouple with 100 nf to gnd. 51 nbias_ana2 input 52 in_adc input analog input of the internal adc. connect to analog output of image sensor (pin 30). input range (typically 2v and 4v) of the internal adc is set between by vlow_adc (pin 55) and vhigh_adc (pin 62). 53 vdd_adc_ana supply analog power supply of the adc (typical 5v). 54 gnd_adc_ana ground analog ground of the adc. 55 vlow_adc input low reference voltage of inte rnal adc. nominal input range of the adc is between 2v and 4v. the resistance between vlow_adc and vhigh_adc is approximately 1.5 k ? . connect with 1k 5 ? to gnd and decouple with 100 nf to gnd. 56 n.c. 57 pbiasdig2 input connect with 20k to gnd and decouple with 100 nf to vdda. 58 bitinvert input digital input. inversion of the adc output bits. 0 = invert output bits (0 => black, 1023; white, 0), 1 = no inversion of output bits (black, 0; white, 1023). 59 tri_adc input digital input. tri-state control of digital adc outputs (1 = tri-state, 0 = normal mode). 60 d0 input adc output bits.#d0 = lsb, d9=msb. 61 clk input digital input. adc clock. adc converts on falling edge. table 8. pin list of the star1000 sensor (continued) pin pin name pin type pin description [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 15 of 21 62 vhigh_adc input high reference voltage of internal adc. nominal input range of the adc is between 2v and 4v. the resistance between vlow_adc and vhigh_adc is about 1.5 k ? . connect with 1k 1 ? to vdda and decouple with 100 nf to gnd. 63 gnd_adc_ana ground analog ground of the adc circuitry. 64 vdd_adc_ana supply analog supply of the adc circuitry (typical 5v). 65 vdd_adc_dig supply digital supply of the adc circuitry (typical 5v). 66 gnd_adc_dig output digital gr ound of the adc circuitry. 67 vdd_dig_out supply power supply of adc digita l output. connect to 5v for normal operation. can be brought to lower voltage when image sensor must be interfaced to low voltage periphery. 68 d1 output adc output bits. #d0 = lsb, d9=msb. 69 d2 output 70 d3 output 71 d4 output 72 d5 output 73 vdda supply analog supply of the image core (typical 5v). 74 gnda ground analog ground of the image core (typical 5v). 75 gnd_ab supply anti-blooming drain control volt age. default: connect to ground where the anti-blooming is operatio nal but not maximal. apply 1v dc for improved anti-blooming. 76 vref supply analog supply. re set level for reset_ds. is used for extended optical dynamic range. see faq for more details. 77 vres supply analog supp ly. reset level for reset (typical 5v). 78 d6 output adc output bits.#d0 = lsb, d9=msb. 79 d7 output 80 d8 output 81 d9 output 82 a0 input digital input. address inputs for row and column addressing. a9=lsb, a0=msb. 83 a1 input 84 a2 input table 8. pin list of the star1000 sensor (continued) pin pin name pin type pin description notes 1. all pins with the same name can be connected together. 2. unused inputs must always be tied to an appropriate level, e.g., vdd or gnd. 3. note on power up behavior: at power on, the image sensor is in an undefined state. it is advised that after start up an addre ss is latched as soon as possible into the y- decoder and the x- decoder to prevent high current consumption. 4. there is no on-chip power supply rejection. this means that every noise signal on the analog supply voltages is copied direct ly to the analog video signal (decoupling of the supply voltages as close as possible to the image sensor is recommended). [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 16 of 21 packaging and geometrical constraints package drawing the detector is packaged in an 84-pin j-leaded package. the detector is mounted into position with thermally and electrically conductive adhesive. the bottom plate of the cavity is electrically connected to a ground pin. the detector is positioned into the cavity such that the optical center of the detector coincide s with the geometrical center of the cavity within a tolerance of 50 m in x- and y direction. the tolerance on the parallelism of the detector is 50 m in x- and y- direction. note: the dimensions in figure 8.are in inches. figure 8. package drawing [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 17 of 21 die alignment figure 9. die alignment glass lids there are 2 glass lid versions available: ? star1000 - quartz glass with air inside the cavity ? star1000bk7 - bk7g18 glass with n 2 inside the cavity die adhesive: 0.08+0.02 window adhesive: 0.08+0.02 glass window: 1.0+/-0.05 die: 0.508+0.01 bonding cavity: 0.508+0.051 die cavity: 0.508+0.051 section a a - drawing not to scale 200 p x y centre of cavity and of fpa centre of silicium offset between centre of silicium and centre of cavity: x: 52 p m y: 200 p m 52 p parallelism in x and y within + 50 mm pin 1 a a [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 18 of 21 soldering and handling soldering and handling conditions take special care when soldering image sensors onto a circuit board. prolonged heating at elev ated temperatures may result in deterioration of the performance of the sensor. the following recommendations are made to ensure that sensor performance is not compromised during end users' assembly processes. board assembly the star250 is very sensitive to esd. device placement onto boards should be done in accordance with strict esd controls for class 0, jesd22 human body model, and class a, jesd22 machine model devices. assembly operators need to always wear all designated and approved grounding equipment; grounded wrist straps at esd protected workstations are recommended including the use of ionized blowers. all tools should be esd protected. manual soldering when a soldering iron is used the following conditions should be observed: use a soldering iron with temperat ure control at the tip. the soldering iron tip temperature should not exceed 350c. the soldering period for each pin should be less than five seconds. reflow soldering reflow soldering is not allowed. precautions and cleaning avoid spilling solder flux on the cover glass; bare glass and particularly glass with antirefle ction filters may be harmed by the flux. avoid mechanical or particulate damage to the cover glass. use isopropyl alcohol (ipa) as a solvent for cleaning the image sensor glass lid. when using other solvents, it should be confirm whether the solvent wil l dissolve the package and/or the glass lid. rohs (lead free) compliance this paragraph reports the use of hazardous chemical substances as required by the rohs directive (excluding packing material). information on lead free soldering the product cannot withstand a lead free soldering process. reflow or wave soldering is not recommended. hand soldering is needed for this part type. solder 1 pin on each side and let the sensor cool down for minimum 1 minute before continuing. note: "intentional content" is defined as any material demanding special attention is contained into the inquired product by these cases: 1. a case that the above material is added as a chemical composition into the inquired pr oduct intentionally in order to produce and maintain the required performance and function of the intended product 2. a case that the above material, which is used intentionally in the manufacturing process, is contained in or adhered to the inquired product. the following case is not treated as "intentional content": a case that the above material is contained as an impurity into raw materials or parts of the intended product. the impurity is defined as a substance that cannot be removed industrially, or it is produced at a process like chemical composing or reaction and it cannot be removed technically. table 9. chemical substances in star250 sensor chemical substance any intentional content if there is any intentional content, in which portion is it contained? lead no - cadmium no - mercury no - hexavalent chromium no - pbb (polybrominate d biphenyls) no - pbde (polybrominated diphenyl ethers) no - [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 19 of 21 ordering information disclaimer fillfactory image sensors are only warranteed to meet the specifications as described in the production data sheet. fillfactory reserves the right to change any information contained herein without notice. please contact info@fillfactory.com for more information. table 10. ordering information fillfactory part number cypress part number package glass lid mono/color star1000 CYIS1SM1000AA-HQC 84-pin jlcc quartz mono star1000-bk7 cyis1sm1000aa-hhc 84-pin jlcc bk7g18 mono [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 20 of 21 ? cypress semiconductor corporation, 2006. the information contained herein is subject to change without notice. cypress semic onductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or ot her rights. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agr eement with cypress. furthermore, cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to re sult in significant injury to the user. the inclusion of cypress products in life-support systems application implies that the manu facturer assumes all risk of such use and in doing so indemni fies cypress against all charges. appendix a: star1000 evaluation system for evaluating purposes, a star1000 evaluation kit is available. the star1000 evaluation kit cons ists of a multifunctional digital board (memory, sequencer, and ieee 1394 fire wire interface) and an analog image sensor board. visual basic software (under windows 2000 or xp) allows the grabbing and display of images from the sensor. all acquired images can be stored in different file formats (8 or 16-bit). all settings can be adjusted dynamically to evaluate the sensors specs. default register values can be loaded to start the software in a desired state. all products and company names mentioned in this document may be the trademarks of their respective holders. [+] feedback [+] feedback
star1000 document number: 38-05714 rev. *b page 21 of 21 document history page document title: star1000 1m pixel radiation hard cmos image sensor document number: 38-05714 rev. ecn no. issue date orig. of change description of change ** 310213 see ecn sil initial cypress release *a 603177 see ecn qgs convert ed to framemaker format *b 649371 see ecn fpw package spec label update + ordering in formation update [+] feedback [+] feedback

▲Up To Search▲

Price & Availability of CYIS1SM1000AA-HQC

	To Download CYIS1SM1000AA-HQC Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .